TG Daily IBM cools 3D chips with integrated water channels - Instablogs
TG Daily IBM cools 3D chips with integrated water channels
Andrew , Hollywood: Jun 6 2008
United States :
Zurich (Switzerland) – Why cool semiconductors with liquid on the surface when you can run water right through them? IBM believes that “tiny rivers of water” within stacked chips may not only advance Moore’s Law, but also pave the way to...
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